Top 11 AI News and Ratings You Should Take a Look At

2. Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM)

Number of Hedge Fund Holders: 158

Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) manufactures and sells semiconductor devices, providing a range of fabrication processes for diverse industries worldwide.

According to Beth Kindig of I/O Fund, Taiwan Semiconductor Manufacturing Company’s (NYSE:TSMC) CoWoS-L packaging technology is projected to capture 50-60% of the market this year, a significant increase from its 15% share in 2024. This growth is driven by strong demand for Nvidia’s Blackwell GPUs.

CoWoS-L is a chip-last packaging technology within the CoWoS platform, integrating features from CoWoS-S and InFO for flexible design. It uses Local Silicon Interconnect (LSI) chips to enable high-density die-to-die connections through multiple copper layers. These LSI chips support various architectures, including SoC-to-SoC, SoC-to-chiplet, and SoC-to-High Bandwidth Memory, and can be reused across different products.