Unidentified Analyst: Great. And then for my follow-up, what are the implications of the ramp of AI and data centers on power supplies and the potential benefit for the adoption of your GaN technology in the data center?
Gene Sheridan: Yes. Great question. In fact, we didn’t really give that color, but you have two fundamental challenges. You’ve got these new standards for higher efficiency Titanium Plus demanding higher efficiency. At the same time, the AI intensive data centers are demanding more power. That’s putting a lot of pressure on the power spies that have to deliver on both of those requirements. That pressure of course is great for GaN because silicon struggles to deliver the higher power density, but also struggles to hit the higher efficiencies of Titanium Plus. So we think all of that is contributing to the acceleration in that market. And of course, we’ll be launching our first GaN-based data centers as we talked about, or shipping into those markets later this year and ramping significantly into 2024.
Unidentified Analyst: Great. Thanks again.
Gene Sheridan: Thanks, Tyler.
Operator: Kevin Cassidy with Rosenblatt Securities, your line is open.
McClain Culver: Hi guys, this is McClain on for Kevin Cassidy. Thanks for taking my question. In your prepared remarks, you spoke briefly on this. But could you give us some detailed commentary on the current silicon carbide supply dynamic? Thanks.
Gene Sheridan: Yes, very good question. We didn’t talk much about it, but last quarter we announced that we signed a multi-year long-term agreement with X-Fab and the material suppliers for the silicon carbide substrate, an EPI that enables a 5x increase in supply from middle of last year when we acquired the company throughout this year and ramping into next year. So that’s a major supplier agreement. As you know, we’re shipping all we can build as much of the industry is. And that supply is going to starts in Q1, but it’s for wafer starts and the material to feed those starts. So we actually feel the significant capacity expansion and therefore the commensurate revenue growth in Q2 when all that increased supply goes through the supply chain. So that’s on track. It’s a great deal for us and will fuel a lot of the silicon carbide growth from Q2 and beyond.
McClain Culver: Okay. Thank you. And then kind of as related follow-up. Could you just give us the provider qualifications for your new substrate provider?
Gene Sheridan: Yes. We haven’t revealed the name or disclose the name of the supplier. So there’s not much more color to add about the substrate and EPI suppliers at this point.
McClain Culver: Okay. Thank you. That’s all.
Gene Sheridan: Thank you.
Operator: Quinn Bolton with Needham, your line is open.
Trevor Janoski: Yes. Hey guys, this is Trevor Janoski on for Quinn. Thanks for letting me hop on and ask a question. So on the EV silicon carbide announcements, and sorry if I missed this, but when do you expect the roadside charger and onboard charger opportunity to begin ramping and become material part of revenue?
Gene Sheridan: Yes, that ramps already occurred. We were shipping even last year when we acquired the company. In fact, we commented that EV last year and that’s only with a quarter and half benefit of the GeneSiC acquisition was at 5% of last year’s revenue. So that’s almost all OBC onboard charger as well as roadside charger. And we highlighted that both of those are growing nicely and really will be accelerated by our EV design center both the general ones supporting customers globally as well as the new GLE collaborative one that we’ve created. And we gave a number of comments about significant position and roadside chargers and why that’s moving up into the right.
Trevor Janoski: And can you comment on the ASPs for these solutions?
