Micron Technology, Inc. (NASDAQ:MU) Q3 2023 Earnings Call Transcript

So — but it’s important to understand is that AI is being served not only by HBM or high-density DRAM modules, but it is also being served by D5 memory and by LP DRAM as well. And this is where with the D5 and LP DRAM products, we gave you some examples in our script as well. A large amount of LP DRAM being used in industry-leading high-performance compute platforms. In fact, the 144 terabyte that we mentioned in DGX, GH 200, about 122 terabyte of that is LP DRAM. And Micron is very well positioned with a differentiated solution of our LP DRAM there today. So I think it’s important to understand that the AI server market is made up of HBM, it’s made up of high-density DRAM modules, includes — it also is made up of DDR5, LP5 and some element of graphics memory as well.

So, we do have a broad portfolio. And in 2024 with HBM and high-density DRAM modules getting into production, I really believe we’ll be extremely well positioned to capture the growing opportunity in AI. And 75% of DRAM on AI servers today is DDR5. And as I emphasized, and as I’m sure you well know, we participate very well in D5. In fact, we led the industry with our D5 products, again, built on 1-beta technology here.

Tom O’Malley: Thank you, Sanjay. And I appreciate you guys sneaking me in.

Operator: Thank you. This does conclude the question-and-answer session as well as today’s program. Thank you, ladies and gentlemen, for your participation. You may now disconnect. Good day.