Bill Brennan: Yes, so I kind of smile thinking about the expectation that we set and talking about cautiousness because if we look at the quarter-to-quarter growth rates, I think they’re pretty exceptional as we climbed back to an equal level or larger level than we picked out prior to the big reset. So I think just beginning the year, I think we had plenty of challenge to maintain that kind of a growth rate, and I feel good about how we look right now. I feel good about the fact that exiting this year, I expect us to be more diversified, not just on a customer basis, but also on a product line basis, so I kind of smiled because we can take what is an exceptional story and we got to make sure that the treadmill doesn’t get sped up to the point where expectations are too high. So I would just say that cautiousness is really wrapped in an incredible story of very fast growth quarter-to-quarter.
Tore Svanberg: Great. And then on the second AEC customer ramps. I think you said that’s already in production. Is now sort of the main part of the ramp or does that come a little bit later?
Bill Brennan: It comes a little bit later. These programs, there’s various stages of qualification early production pilot production and then really a significant ramp. And as we’ve signaled we’ve been somewhat measured in what we’ve included in this year and it looks like it’s going to shape up as to be a much larger FY ’25 ramp.
Tore Svanberg: Sounds good. Thanks for the color. Really appreciate it.
Bill Brennan: Sure.
Operator: And thank you. And one moment for our next question. And our question comes from Brett Simpson from Arete Research. Your line is now open.
Brett Simpson: Yes, thanks very much. Bill, I wanted to just ask on SerDes Chiplets. Can you maybe just talk a little bit about how you see the landscape here over the next couple of years? And I think you called that Tesla is a initial launch customer for SerDes chiplets. And I think they’ve been talking publicly about sort of installing 100 extra flop cluster over the next sort of five or six quarters. Can you maybe just talk a bit about what specifically Credo is doing within this project and more broadly just talk about how you see chiplet IO for Credo particularly now that TSMC is starting to get more and more involved in SOIC and looking at AI customers here? Thank you.
Bill Brennan: Sure. So we’re happy with the relationship that we’ve got with Tesla. This has been multiple years that we’ve been working with them. I’ll first start with the fact that they licensed our 100 gig per lane SerDes IP and in each one of the D1 chips they’ve integrated 576 of those 100 gig lanes. So when we think about total throughput, that’s 57.6 terabits per second for each one of their D1 ASICs. This is why we were so attracted to working on something that was so advanced and it was even a long time ago. When we talk about 51.2 terabits per second switches, we talk about still that’s not expected for some time and so I think from a SerDes IP standpoint, this is a great example of the type of work that our team can do in collaborating with the leading edge design team.
If you look at their tile design, there’s 25 of the D1 ASICs that are really in a five-by-five matrix and surrounding the tile are off-tile connectivity and there’s 40 of our chiplets on each one of their titles. And the chiplets sort of 3.2 terabits per second also 100 gig per lane on each side, one side is XSR to manage the dotted icon activity and then off-chip is a longer reach or off title is longer reach. And so they have been public and talking about ramping. And so that’s where we see meaningful revenue. The second customer that we worked with is Intel and for their 12.8T switch, which is in production now also we did chiplet design for them also 3.2 terabits per second, a little bit different interconnect between die. This was what they call it, a white bus BOW a bunch of wires on the die-to-die connection and then off package was a longer reach 30s.
