Editor’s Note: QUALCOMM, Inc. (NASDAQ:QCOM), Intel Corporation (NASDAQ:INTC), Broadcom Corporation (NASDAQ:BRCM), Apple Inc. (NASDAQ:AAPL)
Qualcomm Assigned Patent for Distributed Building Blocks of R-C Clamping Circuitry in Semiconductor Die Core Area (HispanicBusiness.com)
QUALCOMM, Inc. (NASDAQ:QCOM), San Diego, has been assigned a patent (8,531,806) developed by four co-inventors for a “distributed building blocks of R-C clamping circuitry in semiconductor die core area.” The co-inventors are Reza Jalilizeinali, San Diego, Evan Siansuri, San Diego, Sreeker R. Dundigal, San Diego, and Eugene R. Worley, San Diego. The abstract of the patent published by the U.S. Patent and Trademark Office states: “A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die.
Intel Has Acquired Natural Language Processing Startup Indisys, Price “North” Of $26M, To Build Its AI Muscle (TechCrunch)
Intel Corporation (NASDAQ:INTC) has quietly made another international acquisition in its push into artificial intelligence technology: it has bought Indisys, a Spanish startup focused on natural language recognition. The terms of the deal have not been disclosed, but it is reportedly “north” of €20 million ($26 million). It comes just two months after news broke that Intel acquired Omek, an Israeli maker of gesture-based interfaces, reportedly for about $40 million. Intel Corporation (NASDAQ:INTC) has given us direct confirmation of the deal and noted that the majority of employees joined the company.
Broadcom Joins Electronic Industry Citizenship Coalition (PR Newswire)
Broadcom Corporation (NASDAQ:BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced its acceptance as a full Member of the Electronic Industry Citizenship Coalition (EICC), an alliance of the world’s leading electronics companies working together to improve efficiency and social, ethical, and environmental responsibility in the global supply chain. In becoming a full EICC member, Broadcom will adopt the organization’s code of conduct to ensure worker safety and fairness, environmental responsibility and business efficiency. Broadcom Corporation (NASDAQ:BRCM) commits to conform to the EICC code of conduct in its own operations, progressively implementing the EICC approach and tools in the spirit of the industry’s common goals.
Qualcomm buyback reassures investors (Financial Times)
The S&P 500 failed to extend its recent rally an eighth consecutive day, as chipmaker QUALCOMM, Inc. (NASDAQ:QCOM) recovered some of the ground lost after Apple Inc. (NASDAQ:AAPL)’s poorly received iPhone launch on news of a fresh round of share buybacks. The chipmaker, which is closely tied to the companies such as Apple that use its products in smartphones, added 1.1 per cent to $68.81. QUALCOMM, Inc. (NASDAQ:QCOM) announced a $5bn share buyback programme to follow up its previous $5bn repurchase. The company’s gains on Thursday helped to erase some of Wednesday’s losses, which coincided with a fall in Apple’s shares following its release of new iPhones, including a lower cost version.
Intel says open source 3D printed robots are coming (Inquirer)
3D PRINTED, OPEN SOURCE ROBOTS that are going to bridge the gap between technology and humanity are on their way, according to Intel Corporation (NASDAQ:INTC), which talked about its Twenty-first Century Robot initiative that will “bring science fact to science fiction”. It might sound like a sci-fi film gone terrifyingly wrong, but that’s what Intel’s futurist Brian David Johnson told attendees at a media briefing at the Intel Developer Forum (IDF) in San Francisco. “We’ve been doing this thing called science fiction prototyping… something that you haven’t known about, using science fiction inside of Intel Corporation (NASDAQ:INTC),” said Johnson.
Broadcom proliferates UltraHD STB availability with HEVC chipsets (CIOL)
Broadcom Corporation (NASDAQ:BRCM) announced new industry-leading chipsets that enable operators and OEMs to rapidly introduce UltraHD subscriber hardware and content. These new set-top box (STB) devices for satellite, cable and IP integrate support for the advanced high-efficiency video codec (HEVC) standard H.265 that will allow existing high-speed data networks to better utilize the higher throughput required by UltraHD content. As UltraHD TV prices continue to fall, Broadcom Corporation (NASDAQ:BRCM)’s new family of devices also provides OEMs and operators more options for end-point delivery of UltraHD/4k content.
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