Gus Richard: Just in terms of, as you ramp, do you foresee any capacity constraints or maybe a better way to ask the question is, where do you need to focus to make sure you have capacity as, demand grows?
Rafi Amit: You are talking about the capacity here to manufacture Gus?
Gus Richard: Correct. Yes. Is it in lead times on OpEx? Is it manpower, floor space? Just sort of where would you first run into a capacity constraint?
Rafi Amit: So first of all, I think we discussed in previous calls, we have today capacity. We’ve increased our capacity last year. And today, we have enough capacity for roughly $0.5 billion in sales annually. So the clean room, which is the longest time is there and also the manpower training, we have enough. So the rest is really planning. And as I said, because we understand more or less what is going to happen next year. We have backlog already for next year. So we have we’re talking to customers. We understand what we to stand what we will need to ship. We have already put in orders for what we need from material point of view. We have enough inventory on hand for the next few months, so we do not foresee any reason not to shift all of the machines in 2024.
Gus Richard: And then I think in your prepared remarks, I think you’re starting to see chiplets expand into auto and I think you said mobile as well. And I’m just wondering if you could talk a little bit more about those opportunities and when you might start to see those impact your backlog or your shipments?
Moshe Eisenberg: No, I think here in our remarks what we said that there are other opportunities for business that is not related to chiplets and HBMs, we see opportunities there as well. Our business will be in the range of, let’s say, more than 30% for the HBM and the chiplets. The rest will come from the other segments that we serve. So I think today, the market is focused on the chiplets and HBM. This is high performance computing. I think this is going to what people call AI applications. I think this is today, the main application. Definitely, this in 2, 3 years, no doubt, will become the standard in computing in the industry. But I think there is time till we’ll get to that point.
Gus Richard: And then the last question for me in terms of demand obviously is going up because of unit volume, but I also wonder if you could comment a little bit about inspection times and increasing bump density and what’s happening for how long it takes to inspect a wafer?
Moshe Eisenberg: So you know, this is really application dependent, but no doubt. And I think Rafi mentioned in the prepared remarks that we understand where the market is going to. So, we’ve talked about the fact that the number of pumps are becoming more. They’re increasing numbers. And obviously, they are becoming denser and smaller. And this will require new capabilities. Some of those capabilities we already have installed with customers. There are new capabilities that we are going to qualified customers. So those capabilities, first of all, we’ll improve the throughput on one hand to address the increase in the numbers of bumps or the density. But definitely, all-in-all, some of these applications, they slow the inspection and metrology time in certain applications.
Obviously, I mean, this is the physics of the business and customers are required to purchase more machines. But we’re doing on our hands our best from the, to supply the best ROI in the industry in improving the throughput, the accuracies and everything on our machines.
Kenny Green: Next question is from Vedvati Shrotre from Jefferies.
Vedvati Shrotre: The first one I had is on the 240 system orders that you for packaging. Could you help us understand how maybe these convert to revenues first half ’24 versus second half? Is there, is it more first half weighted versus second half? Any color there would be helpful.
Rafi Amit: Vedvati, obviously, the orders that we see for ’24, so we said most of the 240, somewhere went to Q3 and Q4, some needed quick deliveries. But when we look at next year, obviously, the orders lean more to the first half naturally. And on the second half, we have less the backlog, but we have an understanding from customers. This is where the pipeline comes into place, where people speak with us that they need certain machines in the third quarter of the fourth quarter some event ask for certain slot, but they have not issue yet the deal. Moving the pipeline or converting it from a pipeline to orders, definitely, this is what we will be doing in the next couple of months.
Vedvati Shrotre: And maybe zooming into that a little bit. So most HBM manufacturers and the Chiplet manufacturers have talked about doubling their capacity by 2024. So with these kind of order volumes, do you think they have all the tools they need to achieve that target. Like, what is your sense here? And I know the visibility may be limited, but any color here?
Rafi Amit: Well, what I understand and what we see. We think that they are getting the tools that they need. And I can tell you that if there will be a shortage and they will feel that they will need additional tools, we have enough capacity and enough inventory in place to manufacture more machines. So I think we will not be the bottleneck if this will be needed. At least from our understanding, what we’re seeing, at least I would say for ’24, at least the first half, I think they have enough tools.
