Soroush Dardashti: Yeah, thanks, thanks for your question, Kevin. So look, I think this is an — this is an important area for us because it’s actually one we’re seeing additional inbound interest across industrial applications. You’re right, industrial generally is a kind of broad term. We’re not going after every single piece, but, I would divide this into a couple different pieces. One is around industrial sensing where we have for example, the 40 or the 40 scanning application. This is the approach we’re taking our collaboration with SICK AG, the company that’s one of the leaders, top leaders in the industrial sensing space. There we’re providing, sensor solutions starting with kind of our Aeries II products and for applications around safety automation logistics and as such.
The other approach — the other segment, really what we’re focused on is around or we call precision distance measurements. These are typically applications where it’s not really scanning and the focus really is on measuring precisely either distance of objects or features of things throughout the manufacturing process including manufacturing inspection, metrology and overall other safety topics or interaction between humans and manufacturing automation equipment. And this is what I was mentioning on the call where, with our completion of our LiDAR-on-Chip module or perception platform for industrial sensing, we can now achieve the micron-level precision and this one of our first customers in this space is Nikon, which we have talked about and they’re using that for automotive manufacturing, high volume automotive manufacturing applications.
But also, we see a pull from the market for this distance measurements across other applications, which we think there is a clear existing business and potential for large scale deployment. And this is — this could be from anything from few centimeters of distance to hundreds of meters of distance and the key for us is, unlike other solutions. So first of all, pre-defined LiDAR, what’s out there in the market doesn’t even typically address those markets because of some of the performance inherent limitations. Other existing solutions are either typically across multiple SKUs with different architectures that are focused on some only doing a piece of, it’s a just very short range, some that’s medium range and some that’s longer range. The advantage that we bring here is really that we can achieve that high level performance, micro level precision and as in a compact silicon products chip platform add volume scale, which, based on the manufacture process that we have also in a way that is, from a cost standpoint is affordable and doing so in a way that one solution is able to tackle multiple of these applications from short to longer range.
And we think this is an interesting area from an opportunity standpoint for us. And we are — we’re engaged on multiple opportunities with folks and as we’re able to talk more, we will discuss further.
Kevin Garrigan: Okay. Got it. That makes a lot of sense. I appreciate the color. Thanks guys.
Operator: There are no further questions in the queue. I’d like to hand the call back to management for closing remarks. Soroush Dardashti Thank you for joining the call and we will see you next time.
Operator: Ladies and gentlemen, this does conclude today’s teleconference. Thank you for your participation. You may disconnect your lines at this time and have a wonderful day.
