Gayn Erickson: I don’t know yet. I mean, they had originally talked about and we acknowledge the order for Q1, which could have been through a March shipment. Recently, they’re like sooner the better. So we’re just trying to pull it in.
Larry Chlebina: So you’re in charge of that, we should figure on the February quarter then?
Gayn Erickson: That’s what we’re working on, but they’re listening too. So we’re trying our best to pull it in. It’s awesome. I mean it’s coming along really nicely. There’s a couple of things that we’re still working through from a qualification and thermal uniformity and things. But the system is being built up. We’re actually building it in the integrated configuration. It will not be docked to our new aligner, but it can easily be docked to it. So it’s being configured in the new configuration that will allow it for – to just be rolled up against the new aligner.
Larry Chlebina: So it can go in and fully automate in front end. Is that what you’re –
Gayn Erickson: All they have to do is buy the aligner, and we can bolt on a 300-millimeter front-end on this thing, overhead transport or robotics, and it’s fully [indiscernible] integrated into a high-volume manufacturing floor.
Larry Chlebina: Excellent, really exciting. We’ve seen articles written that Taiwan Semi is pursuing something similar optical I/O. And would they be sneaky enough to be accessing your XP – do you place an XP in Taiwan [indiscernible]? Would they be accessing that machine to do their stabilization and reliability testing versus coming to you directly –
Gayn Erickson: You know what – sometimes when you ask me a question, I’ll just ignore you, but they are not right now. I don’t want people to be left with the opinion that they are. But I think the folks – it’s pretty interesting. We’re trying to read up and we’re talking to key players in the space. AMD, Intel and NVIDIA have all been sort of pounding this drum. And it seems like it’s been picking up on this. And then TSMC and Global Foundries, in particular want to play. They want to be a part of this. And it’s very interesting when you start thinking that it’s not just the chip-to-chip that makes silicon photonics. In the chip itself, there’s bolt-ons firing around inside on big bus planes that are transmitting these multi-gigabyte buses.
And it’s just what semiconductor will look like in a decade versus what they are now is going to drastically change based upon silicon photonics. And for us, not only our processors burnt in, in general, by the way, but our focus has really been on this product has been on the burn-in of the fiber optic transceiver, the integrated laser. But there’s also burn-in opportunities. And this is, as you know, because you’ve asked a lot of questions over the quarters, a lot of the play with bringing up the new aligner was not just silicon carbide. The silicon carbide guys stream wave for level burn-in for processors, automotive microcontrollers, and memory, we think for sure it’s just too high volume. You can’t be handling WaferPaks and walking them between a car and a thing.
So that’s what we did for we’re thrilled to death, and the systems – the systems are working really well. We’re getting really good feedback. We got another customer in here today. I know that’s teasing and they’re super impressed with it, and we’re just pretty proud of it.
Larry Chlebina: Another customer that you say for what market?
Gayn Erickson: I didn’t say that.
Larry Chlebina: I know – how did you describe them? I’m sorry, I miss…
Gayn Erickson: I just said another customer that’s in here looking at it, and they’re very excited, and they gave us some very good feedback.
